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Feature:
1. Soldering Flux: Using this soldering paste, you will find the soldering much easier and your working more efficient.
2. Reliable Works: Ensuring easy tinning, no residue, high insulation resistance, cleaning free, practical and reliable.
3. Practical Uses: Can be used ball or pin connection for BGA, PGA and CSP packages as well as varied assembly operation.
4. Large Capacity: Has a large capacity up to 10cc, also has a drawing tube and a needle, the operation will be easier.
5. Easy Carrying: Designed to have compact size and light weight, both the daily storage and carrying are very convenient.
Specification:
Item Type: Solder Flux
Wide Applications: Generally used in sensors, wires, tubes, BGA chips, etc.
Product Features: Environmental protection, easy tinning, no residue, high insulation resistance, cleaning free.
Size: 93 x 33 x 23mm
Color: as picture shown
Material: lead tin
Capacity: 10cc
Product performance:
1. RMA-223 is a moderately active rosin-type soldering paste, which is widely used in the SMD rework process of mobile phone boards.
2. It is a no-clean solder paste, the color of the residue is very light, and it has a very high SIR value. It is recommended to be used for BGA, CSP and other ball array solder joint repair and ball filling.
Note
1. Due to differences in light and screen adjustments, the color of the item may be slightly different from the picture.
2. Due to manual measurement, please allow 1-3 cm measurement deviation.
Package List:
1 x Solder Flux
1 x Draw Tube
1 x Needle
Label: Yes
